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Thermal Paste

Providing you the best range of thermal compound/ heat sink paste with effective & timely delivery.

Thermal compound/ Heat Sink Paste

Thermal compound/ Heat Sink  Paste
  • Thermal compound/ Heat Sink  Paste
  • Thermal compound/ Heat Sink  Paste
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Product Details:

Packaging Size50/100/1000/5000GRAM
Application IndustryTelecom, LED/LIGHTING/ELECTRONICS, Automotive
Surface Of ApplicationCeramic, Plastic, Metal
Grade StandardIndustrial
StrengthALL TYPES W/mk
Material CompatibilityMetal, Ceramic, Plastic
Chemical ResistanceAutomotive Fluids, Water, Acids
Shelf Life30+ MONTH
Country of OriginMade in India

CHEMSOL thermal conductive  Compound/Paste/Gel:is designed to provide efficient thermal transfer for the cooling of PCB system assembly modules used in computer, power supply, and automotive applications, it has high thermal conductivity, low thermal resistance, no flow, very low oil bleed, no sedimentation, no volatility, and good wattability.Can be applied for cooling the interface of cooler heatsink and GPU VRM VRAM PCB LED, BJT MOSFET transistor, Voltage regulator, IC Chips, etc
 The deformability is very low, it can be compressed to the thinnest 0.1mm, there is almost no hardness, and there is no internal stress on the equipment. It can fill any uneven gap and is safe and non-conductive. It is widely used in the fields of LED chips, communication equipment, mobile phone CPU, memory module IGBT and other tool modules, and power semiconductors. 
PCB system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. The primary advantage of this product is easy application with less consumption resulting in lowering the cost per unit. will not leach, dry, soft, harden or melt for most critical conditions for longer periods

General Information :

This product is not recommended for use in pure oxy

gen and/or  oxygen  rich  systems  and  should  not  be  select

ed as   a   sealant   for   chlorine   or   other   strong   oxidizing



Handling :

Before   handling,   read   product   safety   data   sheets

(MSDS) and container labels for safe use.


Directions for use:

Substrate preparation

Surfaces to be adhered  or  sealed should be free of

dirt, oil  and  other  contaminants.

For  best  performance

the  surface  with  a  solvent  such  as  isopropyl  alcohol

acetone  or  methyl  ethyl  ketonecloth.


Excess  material  can  be  easily  wiped  away  with

cloth or non-polar solvents



The  optimal  storage  condition  is 

below   or   more   than   the   temperature   specified,   has

impact on the product properties.

Material  removed  from  containers may  be  contaminate

during use. 


Surfaces to be adhered  or  sealed should be free of


For  best  performance

clean the  surface  with  a  solvent  such  as  isopropyl  alcohol

,acetone  or  methyl  ethyl  ketone or  with  coarse  lint  free. 

** Dependent on processing conditions. Excellent thermal properties observed after 1000 hr @ 85°C, 85%RH and 1000 hr @ 150°C.


Additional Information:

  • Delivery Time: 1-2 WEEK
  • Packaging Details: 50/100 GRAM TUBES / PET JAR 1 Kg. Can, 5/20KG. PAIL 50 kg. Drum
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Sunil Lakhotia
Chemsol India
G-39, Ground Floor, Vardhman CSC Complex, Ram Vihar
New Delhi - 110092, Delhi, India

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